The semiconductor material process is developing from the first-generation single-element semiconductor to the second- and third-generation semiconductors such as gallium arsenide (GaAs), gallium nitride (GaN), and silicon carbide (SiC). The update of emerging materials brings about new requirements and challenges.

The chip needs to be obtained by dividing a sub-unit (a chip particle) on the wafer. "Wafer dicing process" refers to dicing or grooving the wafer or its components to facilitate subsequent process or functional testing. "Wafer dicing" requires high cutting accuracy. Wafers are made of ultra-brittle materials, and the control of positive and back collapse is also very strict. Wafer products are high value-added products, and the reliability requirements of dicing equipment are also very high.

As the semiconductor manufacturing process becomes more and more sophisticated, the manufacturing cost is getting higher and higher, so the industry puts forward higher requirements for the product utilization rate of single wafers.Laser scribing can make chip layout finer, and the processing process is cleaner and more efficient. Laser scribing has become an important means for semiconductor companies to improve product production efficiency and production quality.

Especially for some wafers or chips containing low-k materials, their soft structure and easy permeability make CMP (Chemical Mechanical Polishing) and cleaning procedures more difficult, resulting in a decline in yield and an increase in production costs.Strong Laser's ultra-fast laser system for wafer has the advantages of accurate cutting, small heat-affected zone, non-contact processing, no cleaning process, no secondary pollution, etc. It is the first choice in the industry.