Model：SLCU-10055I
Industry applications: Cutting and drilling processes for transparent and brittle materials such as sapphire, optical glass, semiconductor packaged chips, silicon wafers, glass covers, etc.
Using picosecond or femtosecond laser, ultra-short pulse processing without heat conduction, suitable for high-speed cutting and drilling of any organic & inorganic materials, with a minimum of 10μm chipping and heat affected zone.
Using single laser dual optical paths splitting technology and double laser head processing, the efficiency is doubled.
CCD vision prescan & automatic target positioning, maximum processing range 650mm×450mm, XY stage splicing accuracy ≤±3μm
Support a variety of visual positioning features, such as crosses, filled circles, hollow circles, L-shaped right-angle sides, image feature points, etc.
Realize automatic cleaning, visual detection and sorting, and automatic loading and unloading.
12 years of R&D technology accumulation of laser micromachining system, stable performance, no consumables.
| Optical unit | ||
|---|---|---|
| Number | Project | Parameter |
| 01 | Laser type | 365/532/1064μmOptional |
| 02 | Cooling method | Constant temperature water cooling |
| 03 | Laser power | 10-100W |
| 04 | Beam quality | M²＜1.3 |
| 05 | Processing head number | Flat field focusing lens double head |
| 06 | Minimum focus spot diameter | Φ15μm |
| Laser processing performance | ||
|---|---|---|
| Number | Project | Parameter |
| 01 | Processing speed | 100-1500mm/s Adjustable |
| 02 | Minimum edge collapse | 15μm |
| 03 | Maximum processing size accuracy | 250mm*250mm，±5μm |
| 04 | Maximum processing material thickness | 1mm |
0769-83131319Tel：0769-83131319
Add: 2nd Floor, Building 3, Kusai Technology Park, No. 8 Fumin South Road, Dalang Town, Dongguan City
Tel：15312164555
Add: Building 8, No. 200 Shengpuxing Road, Suzhou Industrial Park
0769-85641965
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