Industry applications: Cutting and drilling processes for transparent and brittle materials such as sapphire, optical glass, semiconductor packaged chips, silicon wafers, glass covers, etc.
Using picosecond or femtosecond laser, ultra-short pulse processing without heat conduction, suitable for high-speed cutting and drilling of any organic & inorganic materials, with a minimum of 10μm chipping and heat affected zone.
Using single laser dual optical paths splitting technology and double laser head processing, the efficiency is doubled.
CCD vision prescan & automatic target positioning, maximum processing range 650mm×450mm, XY stage splicing accuracy ≤±3μm
Support a variety of visual positioning features, such as crosses, filled circles, hollow circles, L-shaped right-angle sides, image feature points, etc.
Realize automatic cleaning, visual detection and sorting, and automatic loading and unloading.
12 years of R&D technology accumulation of laser micromachining system, stable performance, no consumables.
|02||Cooling method||Constant temperature water cooling|
|05||Processing head number||Flat field focusing lens double head|
|06||Minimum focus spot diameter||Φ15μm|
|Laser processing performance|
|01||Processing speed||100-1500mm/s Adjustable|
|02||Minimum edge collapse||15μm|
|03||Maximum processing size accuracy||250mm*250mm，±5μm|
|04||Maximum processing material thickness||1mm|