Model：Honor Series 6040
Application: cutting and dicing for semiconductor integrated circuits, wafers, etc.
The machine is equipped with a picosecond laser, the spot diameter is as small as 3μm, the cutting channel is only 10μm, the slit is narrow. There is no thermal effect, and no damage to the chip circuit, so the output rate of the machine is high.
The scribing speed is up to 500mm/s. For samples with a thickness of 1mm, the machine can break them at once.
The maximum range of CCD vision pre-scanning & automatic target-grabbing positioning: 650mm×450mm, XY platform stitching accuracy ≤±3μm.
The product has no taper after cutting, and its edge is smooth. The minimum chipping edge is 3μm.
Support a variety of visual positioning features, such as crosses, solid circles, hollow circles, L-shaped right-angle edges, image feature points, etc.
The machine Equipped with a robot automatic loading and unloading system, that can greatly saves staff costs.
| Optical unit | ||
|---|---|---|
| No. | Item | Index |
| 01 | Laser | 1064nm 10ps |
| 02 | Colding way | water |
| 03 | Power | 50W |
| 04 | Beam quality | M²＜1.3 |
| 05 | Focusing | Single point focusing lens |
| 06 | Number of processing station | single station |
| 07 | Minimum spot diameter | Φ3μm |
| Processing performance | ||
|---|---|---|
| No. | Item | Index |
| 01 | Speed | 100-1000mm/s optional |
| 02 | Minimum chipping | 3μm |
| 03 | Maximum material thickness | 1mm |
| 04 | Maximum procession size | 12inches |
| 05 | Precision | ±5μm |
0769-83131319Tel：0769-83131319
Add: 2nd Floor, Building 3, Kusai Technology Park, No. 8 Fumin South Road, Dalang Town, Dongguan City
Tel：15312164555
Add: Building 8, No. 200 Shengpuxing Road, Suzhou Industrial Park
0769-85641965
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