皮秒激光高硬度脆性材料切割机.png

Strong picosecond laser cutting machine for high hardness and brittle materials

Model:Super-Dmicro650

Application: sapphire & glass cover and other brittle & transparent materials industry

Advantages

The machine is equipped with a picosecond or femtosecond laser, and there is no heat conduction during the processing. It is suitable for high-speed cutting and drilling of any organic and inorganic materials. The minimum chipping and heat-affected zone is 10μm.

Although the equipment has only one laser, it has two processing stations, which doubles the efficiency.

The equipment has CCD vision pre-scanning & automatic target-grabbing and positioning functions. Its maximum processing range is 650mm×450mm, and the stitching accuracy of the XY platform is ≤±3μm.

It supports a variety of visual positioning features, such as crosses, solid circles, hollow circles, L-shaped right-angle edges, image feature points, etc.

It also has functions such as automatic cleaning, visual inspection and sorting, and automatic loading and unloading.

Strong has accumulated R&D and design technology for laser micro-fabrication system for 12 years to ensure that the performance of the machine is stable.

Specification
Optical unit
NumberProjectParameter
01Laser type355、532、1064μm optional
02Cooling waywater
03Laser power10-100W
04Beam qualityM²<1.3
05FocusingFlield lens + focusing lens
06Number of processing stationdouble stations
07Minimum spot diameterΦ15μm
Performance
NumberProjectParameter
01Speed100-1500mm/s adjustable
02Minimum chipping15μm
03Maximum material thickness≤1mm
04Maximum procession size250mm×250mm
05Precision±5μm
Sample
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