Model：SLDR-8070I
Industry application: Used in the drilling process of HDI, chip inductor ceramics, semiconductor microelectronics TSV, engine fuel injectors and others in the PCB industry
The machine uses a picosecond laser, which has ultrashort pulse and no heat conduction during processing. It is suitable for high-speed drilling of ceramic thin-film materials.
The machine uses single laser dual optical path splitting technology, with dual laser head processing, which doubles the efficiency;
The drilling speed is up to 2000 holes/s, the diameter of the minimum hole is 10μm, the roundness is more than 95%, and the edge of the small hole is smooth and free of burrs;
The machine is equipped with CCD vision pre-scanning & automatic target-grabbing positioning system, the maximum processing range is 650mm×450mm, and the stitching accuracy of the XY platform is ≤±3μm;
The machine supports a variety of visual positioning features, such as crosses, solid circles, hollow circles, L-shaped right-angle edges, images, etc.;
Strong has accumulated R&D and design technology for laser micro-fabrication system for 12 years to ensure that the performance of the machine is stable. Our machine haven’t consumables even after 20,000 hours of work.
| Optical unit | ||
|---|---|---|
| Number | Project | Parameter |
| 01 | Laser type | 355、1064nm (optional) |
| 02 | Cooling way | water |
| 03 | Laser power | 10-100W |
| 04 | Beam quality | M²＜1.3 |
| 05 | Number of processing station | Plan focusing lens, double head |
| 06 | Minimum spot diameter | Φ8μm |
| Performance | ||
|---|---|---|
| Number | Project | Parameter |
| 01 | Speed | Single head 2000 holes/s |
| 02 | Maximum material thickness | 0.5mm |
| 03 | Maximum processing size | 250mm*250mm |
| 04 | Accuracy | ±3μm |
| 05 | Minimum heat affected zone | 1.5μm |
0769-83131319Tel：0769-83131319
Add: No.21，Dalang Xinbao 2nd Street，Dalang Town，Dongguan City，Guangdong Province
Tel：15312164555
Add: Building 8, No. 200 Shengpuxing Road, Suzhou Industrial Park
0769-85641965
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