皮秒.jpg

Strong laser cutting ultrafast machine in femtosecond & picosecond

Model:SLCU-11075I


Industry applications: Cutting and drilling process of PCB circuit board, LCP and soft-hard combination board, fingerprint recognition module, camera module and others

Advantages

The machine is equipped with a picosecond or femtosecond laser. The laser has ultra-short pulses and has almost no heat conduction during processing. It is suitable for high-speed cutting of any organic/inorganic material. The minimum chipping and heat-affected zone is 3μm;

The machine is equipped with CCD vision pre-scanning & automatic target-grabbing positioning system, the maximum processing range is 650mm×450mm, and the accuracy of the XY platform is ≤±3μm;

The machine supports a variety of visual positioning features, such as crosses, solid circles, hollow circles, L-shaped right-angle edges, image feature points, etc.;

The machine has the functions of automatic split cleaning, visual inspection and sorting, and automatic loading and unloading of robots;

With 12 years of R&D technology accumulation and the selection of key components of the world's top brands, the machine can work continuously for 7×24 hours without failure.

Specifications
Optical unit
NumberProjectParameter
01Laser type355、532、1064nm 10ps (Optional)
02Cooling waywater
03Laser power10-100W
04Beam qualityM²<1.3
05Number of processing stationSingle point & plan focusing lens, double head
06Minimum spot diameterΦ3-15μm
Laser processing performance
NumberProjectParameter
01Speed≤120mm/s
02Minimum chipping3μm
03Maximum material thickness2mm
04Maximum material size12inches
05Accuracy±5μm
Sample show
  • 样品1.png
  • 样品3.png
  • 样品2.png
  • 样品4.jpg
Advisory MicroBlog

WeChat

Tik Tok

TOP