Model:SLCU-11075I
Industry applications: Cutting and drilling process of PCB circuit board, LCP and soft-hard combination board, fingerprint recognition module, camera module and others
The machine is equipped with a picosecond or femtosecond laser. The laser has ultra-short pulses and has almost no heat conduction during processing. It is suitable for high-speed cutting of any organic/inorganic material. The minimum chipping and heat-affected zone is 3μm;
The machine is equipped with CCD vision pre-scanning & automatic target-grabbing positioning system, the maximum processing range is 650mm×450mm, and the accuracy of the XY platform is ≤±3μm;
The machine supports a variety of visual positioning features, such as crosses, solid circles, hollow circles, L-shaped right-angle edges, image feature points, etc.;
The machine has the functions of automatic split cleaning, visual inspection and sorting, and automatic loading and unloading of robots;
With 12 years of R&D technology accumulation and the selection of key components of the world's top brands, the machine can work continuously for 7×24 hours without failure.
Optical unit | ||
---|---|---|
Number | Project | Parameter |
01 | Laser type | 355、532、1064nm 10ps (Optional) |
02 | Cooling way | water |
03 | Laser power | 10-100W |
04 | Beam quality | M²<1.3 |
05 | Number of processing station | Single point & plan focusing lens, double head |
06 | Minimum spot diameter | Φ3-15μm |
Laser processing performance | ||
---|---|---|
Number | Project | Parameter |
01 | Speed | ≤120mm/s |
02 | Minimum chipping | 3μm |
03 | Maximum material thickness | 2mm |
04 | Maximum material size | 12inches |
05 | Accuracy | ±5μm |