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Strong laser picosecond scribing machine automated for wafer

Model:Honor Series 6040


Application: cutting and dicing for semiconductor integrated circuits, wafers, etc.

Advantages

The machine is equipped with a picosecond laser, the spot diameter is as small as 3μm, the cutting channel is only 10μm, the slit is narrow. There is no thermal effect, and no damage to the chip circuit, so the output rate of the machine is high.

The scribing speed is up to 500mm/s. For samples with a thickness of 1mm, the machine can break them at once.

The maximum range of CCD vision pre-scanning & automatic target-grabbing positioning: 650mm×450mm, XY platform stitching accuracy ≤±3μm.

The product has no taper after cutting, and its edge is smooth. The minimum chipping edge is 3μm.

Support a variety of visual positioning features, such as crosses, solid circles, hollow circles, L-shaped right-angle edges, image feature points, etc.

The machine Equipped with a robot automatic loading and unloading system, that can greatly saves staff costs.

Specification
Optical unit
No.ItemIndex
01Laser1064nm 10ps
02Colding waywater
03Power50W
04Beam qualityM²<1.3
05FocusingSingle point focusing lens
06Number of processing stationsingle station
07Minimum spot diameterΦ3μm
Processing performance
No.ItemIndex
01Speed100-1000mm/s optional
02Minimum chipping3μm
03Maximum material thickness1mm
04Maximum procession size12inches
05Precision±5μm
Sample show
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