Model:Super-Dmicro650
Application: sapphire & glass cover and other brittle & transparent materials industry
The machine is equipped with a picosecond or femtosecond laser, and there is no heat conduction during the processing. It is suitable for high-speed cutting and drilling of any organic and inorganic materials. The minimum chipping and heat-affected zone is 10μm.
Although the equipment has only one laser, it has two processing stations, which doubles the efficiency.
The equipment has CCD vision pre-scanning & automatic target-grabbing and positioning functions. Its maximum processing range is 650mm×450mm, and the stitching accuracy of the XY platform is ≤±3μm.
It supports a variety of visual positioning features, such as crosses, solid circles, hollow circles, L-shaped right-angle edges, image feature points, etc.
It also has functions such as automatic cleaning, visual inspection and sorting, and automatic loading and unloading.
Strong has accumulated R&D and design technology for laser micro-fabrication system for 12 years to ensure that the performance of the machine is stable.
Optical unit | ||
---|---|---|
Number | Project | Parameter |
01 | Laser type | 355、532、1064μm optional |
02 | Cooling way | water |
03 | Laser power | 10-100W |
04 | Beam quality | M²<1.3 |
05 | Focusing | Flield lens + focusing lens |
06 | Number of processing station | double stations |
07 | Minimum spot diameter | Φ15μm |
Performance | ||
---|---|---|
Number | Project | Parameter |
01 | Speed | 100-1500mm/s adjustable |
02 | Minimum chipping | 15μm |
03 | Maximum material thickness | ≤1mm |
04 | Maximum procession size | 250mm×250mm |
05 | Precision | ±5μm |