Model:SC-K2100
Industry application: Etching process used in 100-inch super-large industrial teaching resistors, capacitive touch screen silver paste, ITO, various metal conductive films, solar photovoltaic silicon substrate films and other products
The process of the equipment is dry etching, its processing is simple, all processing is controlled by software. The product consistency is high, and the yield rate is as high as 99%.
The minimum etching line width is 20μm. The machine supports the simultaneous etching of silver paste lines and ITO at the same time, which can easily achieve the etching of single-layer multi-point capacitive screen sensor lines.
The processing range is 2850mm×1300mm. Its splicing accuracy is ≤±5mm , which is very suitable for the etching of large-screen silver paste or conductive oxide film circuits.
The machine has a CCD vision automatic target-finding function and supports a variety of visual positioning features. Even with 5 million pixels, the target grasping time is less than 1 second, which overcomes the problem of laser etching deviation caused by excessive printing deformation, and the positioning accuracy is ≤±3μm.
Even if it works for 50,000 hours, the laser etching machine has no consumables, maintenance-free, low cost, and can replace the yellow light process.
Optical unit | ||
---|---|---|
Number | Project | Parameter |
01 | Laser type | 1064nm(Nanosecond & picosecond) (optional) |
02 | Laser power | 20W-50W (optional) |
03 | Beam quality | M²<1.3 |
04 | Focusing way | Plan focusing lens |
05 | Processing station | Single/Double |
06 | Minimum focus spot diameter | Φ15μm |
Laser processing performance | ||
---|---|---|
Number | Project | Parameter |
01 | Speed | 1000-4000mm/s(Adjustable) |
02 | Minimum etching line width | 20μm |
03 | Etching line width accuracy | ±1.5μm |
04 | Maximum working range | 2.85m*1.3m Any automatic splicing |
05 | Etching line splicing accuracy | ≤ ±5μm |