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Strong laser etching machine with ultra-large format

Model:SC-K2100


Industry application: Etching process used in 100-inch super-large industrial teaching resistors, capacitive touch screen silver paste, ITO, various metal conductive films, solar photovoltaic silicon substrate films and other products

Advantages

The process of the equipment is dry etching, its processing is simple, all processing is controlled by software. The product consistency is high, and the yield rate is as high as 99%.

The minimum etching line width is 20μm. The machine supports the simultaneous etching of silver paste lines and ITO at the same time, which can easily achieve the etching of single-layer multi-point capacitive screen sensor lines.

The processing range is 2850mm×1300mm. Its splicing accuracy is ≤±5mm , which is very suitable for the etching of large-screen silver paste or conductive oxide film circuits.

The machine has a CCD vision automatic target-finding function and supports a variety of visual positioning features. Even with 5 million pixels, the target grasping time is less than 1 second, which overcomes the problem of laser etching deviation caused by excessive printing deformation, and the positioning accuracy is ≤±3μm.

Even if it works for 50,000 hours, the laser etching machine has no consumables, maintenance-free, low cost, and can replace the yellow light process.

Specifications
Optical unit
NumberProjectParameter
01Laser type1064nm(Nanosecond & picosecond) (optional)
02Laser power20W-50W (optional)
03Beam qualityM²<1.3
04Focusing wayPlan focusing lens
05Processing stationSingle/Double
06Minimum focus spot diameterΦ15μm
Laser processing performance
NumberProjectParameter
01Speed1000-4000mm/s(Adjustable)
02Minimum etching line width20μm
03Etching line width accuracy
±1.5μm
04Maximum working range2.85m*1.3m Any automatic splicing
05Etching line splicing accuracy≤ ±5μm
Sample show
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