Model:SC-K600
Industry application:
Etching and repairing silver paste circuit of resistive and capacitive touch screen
Etching of ITO and various metal conductive film lines
Lithography of thin film circuits and laser etching of masks in the PCB industry
Etching of thin film circuits on solar photovoltaic silicon substrates
The process of the equipment is dry etching, its processing is simple, all processing is controlled by software, the product consistency is high, and the yield rate is as high as 99%.
The minimum etching line width is 20μm. The machine supports the simultaneous etching of silver paste lines and ITO at the same time, which can easily achieve the etching of single-layer multi-point capacitive screen sensor lines.
The processing range is 650mm×550mm. Its splicing accuracy is ≤±3μm.
The machine has a CCD vision automatic target-finding function and supports a variety of visual positioning features. Even with 5 million pixels, the target grasping time is less than 1 second, which overcomes the problem of laser etching deviation caused by excessive printing deformation, and the positioning accuracy is ≤±3μm.
Even if it works for 50,000 hours, the laser etching machine has no consumables, maintenance-free, low cost, and can replace the yellow light process.
Optical unit | ||
---|---|---|
Number | Project | Parameter |
01 | Laser type | 532/1064nm(Nanosecond/picosecond optional) |
02 | Laser power | 20W |
03 | Beam quality | M²<1.3 |
04 | Focusing way | Plan focusing lens |
05 | Processing station | Single/Double |
06 | Minimum focus spot diameter | Φ20μm/Φ10μm |
Performance | ||
---|---|---|
Number | Project | Parameter |
01 | Speed | 1000-4000mm/s |
02 | Minimum etching line width | 20μm |
03 | Etching line width accuracy | ±3μm |
04 | Maximum working range | 650mm*650mm Any automatic splicing |
05 | Etching line splicing accuracy | ±3μm |