Model:SLCU-200160I-TFT
Industry application: Mobile phone panel, car panel etc.
Using picosecond laser, self-developed silk technology, and focused beam diameter as small as 1-2μm to ensure no damage to the TFT circuit;
The equipment is equipped with a self-developed picosecond laser, its diameter of the beam spot is as small as 1-2μm, which can ensure no damage to the TFT circuit.
The cutting speed of this machine is as high as 120mm/s. For a single layer of glass with a thickness of 1.5mm, it can be cut into any pattern and can be broken at one time.
The equipment has the function of CCD visual pre-scanning & automatic target-grabbing and positioning .Its maximum processing range is 3-12 inches.
The product has no taper after cutting, and its edge is smooth.
Support a variety of visual positioning features, such as crosses, solid circles, hollow circles, L-shaped right-angle edges, image feature points, etc.
The equipment can be equipped with AOI visual inspection function, that can save the subsequent inspection time; It can be equipped with ultrasonic or mechanical splitting for splitting, that precision is high.
Strong has accumulated R&D and design technology for laser micro-fabrication system for 12 years to ensure that the performance of the machine is stable. Our machine haven’t consumables even after 20,000 hours of work.
The machine Equipped with a robot automatic loading and unloading system, that can greatly saves staff costs.
Optical unit | ||
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Number | Project | Parameter |
01 | Laser type | 1064nm picosecond |
02 | Cooling way | water |
03 | Laser power | ≥15W |
04 | Beam quality | M²<1.3 |
05 | Number of processing station | Single/double head optional |
06 | Minimum focus spot diameter | Φ1-2μm |
Performance | ||
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Number | Project | Parameter |
01 | Speed | ≤120mm/s |
02 | Maximum material thickness | ≤1mm(Movable Z axis can cut thickness of 2-3mm) |
03 | Maximum processing size accuracy | ±3μm |
04 | CCD visual positioning accuracy | ±3μm |