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Strong laser drilling system by ultra-fast for PCB

Model:SLZK-8070I-PCB

Application:PCB multilayer interconnection board drilling blind holes, chip-to-chip mode

Advantages

Nanosecond laser-hot melt processing, this process relies on the thermal accumulation of laser energy to melt and even volatilize the material. The pulse duration is long, which leads to heat accumulation and conduction in the material and has a large thermal influence to the edge of the processed material. It is easy to produce slag and debris.

Picosecond & Femtosecond Laser——The principle of this process is vaporization and ablation or modification processing. Its pulse width is extremely short. It relies on its own extremely high peak power to instantly gasify the material, with minimal thermal effect and no melting beads. The processing edges are neat.

Specification
No.ItemIndex
01Laser type515/532nm ps
02Laser power90W
03Drilling accuracy±20um
04Efficiency1200 holds/head/s (90um)
05SoftwareStrong self-developed control software
06CCD visual positioning systemCCD vision automatic positioning, size compensation, field of view range 6*8mm
07X, Y linear motor motion platform850X700mm 800mm/sacceleration
08X, Y platform positioning accuracy±1.5um
09Scanning range of galvanometer50x50mm
10Process methodLarge Window / Conformal Mask / Cu Direct
11Automatic loading and unloading timeWithin 12 seconds
12Size4080X2270X2000(mm)
13Consumption20KW
Sample
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